X/XS/XSMAX Motherboard Layered Test Frame Stand

Motherboard Layered Test Frame Stand

X/XS/XSMAX Phone Motherboard Layered Test Frame Stand

  • SIM card groove design

    Design of the card groove can solve the

    problem of testing SIM card function

  • Surface abrasive blasting treatment

    Abrasive blasting process can increase the

    friction and achieve the anti-slip effect

  • Imported Becu Spring Probe

    Good conductivity, to connect the

    motherboard with more accuracy

  • Precise Positioning

    Exquisite production process and strict screening

    are only for more efficient motherboard testing

  • CNC Machining Craft

    To control every little detail

  • Use with middle frame

    No gasket is needed

  • Use without middle frame

    Gasket is needed

  • Multiple models

    Different test frame stands are used for

    different phone motherboards

Mega-Idea Motherboard Layered Test Frame Stand

Offering you a product with affordable price as well as good quality

Product Parameters

Brand: Mega-Idea

Product:Motherboard Layered Test Frame Stand

Application Temperature:-50℃~300℃

Measurement Unit:Milimeter(mm)

Product Details

Model 1:phone X

Model 2:phone XS/XS MAX

Model 3:phone 11

Model 4:phone 11pro/pro max


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【X/XS/XSMAX Motherboard Layered Test Frame Stand】

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