Support Phone X/11/12 series motherboard reballing
of middle frame reballing for all models
A few of simple steps
to reball easily
The auxiliary lines quickly locate the placement position
of the corresponding model without multiple attempts
Each step of reballing is processed in details
to help clipping the motherboard firmly in high temperature
Take the stencil from the corners of edges
to avoid the removal of the solder paste,
due to the large-area mesh detachment at the same time
The magnetic force effectively reduces the gap between the stencil and the motherboard,
preventing the stencil from moving slightly and causing poor reballing effects
Quality synthetic stone, steel
Remove the stencil after the application of the solder paste
Do not to blow the stencil directly with a hot air gun
Brand: QianLi
Product: 10 in 1 Middle Frame Reballing Platform
Functions: Motherboard reballing, repair
Material: synthetic stone, steel
Specification：Reballing platform*1, 10 models reballing stencils
(8 pieces in total), SIM card baffle*2
Model 1：phone x/ xs/XSM
Model 2：phone 11/11P/11PM
Model 3：phone 12/12P/12PM/12Mini
Product Size：106*60*10
Packaging Size：108.5*62*11.5
Size Unit: millimeter (mm)
